Small or medium scale focused research project
Packaging of Future Integrated Modular Electronics

In the embedded electronics field, packaging is the housing of the dismountable equipment.
- It ensures the physical and electrical interface between the aircraft and the electronics.
- It ensures the protection of the electronics in its environment (vibrations, Electromagnetic Interferences, thermal…)
- It supports the handling during aircraft manufacturing and airline maintenance. The packaging, as the physical support to the electronic functions, is the place where most of the problems and failures originate. These major sources of failure affect the reliability of electronic equipment as shown below: vibration and shocks, temperature and contamination (including humidity), sand and dust, Electro-Magnetic Interferences / Electro-Magnetic Compatibility (EMI / EMC), handling, Single Event Upsets and Multiple Event Upsets (SEU and MEU are radiation effects on digital components).

Therefore this project will address in priority the main problem areas that may be the source of future problems (thermal aspects, mechanical aspects, interconnections, and electromagnetic interference) without forgetting all the other constraints (noise, toxicity, environment, cost…) necessary to ensure a consistent and efficient product for all the phases of the aircraft development and operations.

The prime objective of the PRIMAE project is to develop the packaging of future on-board avionics and electronics equipment by replacing the thirty five year old ARINC 600 packaging standard with a new standard adapted to the evolution of the technologies and new aircraft programme constraints (weight, volume, cost, power density, scalability…)



The concept, once harmonized among the European stakeholders participating in this project, will be proposed as future standard for the next generation of large and regional aircraft, initially through the European standardisation bodies, like ASD-STAN, then at international level.